HEMT with Compensation Structure

ABSTRACT

A high electron mobility transistor includes a source, a gate and a drain, a first III-V semiconductor region, and a second III-V semiconductor region below the first III-V semiconductor region. The high electron mobility transistor further includes a compensation structure interposed between the first and second III-V semiconductor regions so that the first and second III-V semiconductor regions are spaced apart from one another by the compensation structure. The compensation structure has a different band gap than the first and second III-V semiconductor regions.

PRIORITY CLAIM

This application is a continuation of U.S. application Ser. No.13/213,351 filed 19 Aug. 2011, the content of said applicationincorporated herein by reference in its entirety.

TECHNICAL FIELD

The present application relates to high electron mobility transistors,in particular high electron mobility transistors with integrated lowforward bias diodes.

BACKGROUND

Conventional high electron mobility transistors (HEMTs) fabricated inGaN/AlGaN technology are typically majority carrier devices, i.e. onlyone type of carriers (electrons or holes) are mainly involved indetermining the electrical properties of the device. This feature isparticularly beneficial for III-V diodes when compared to classicalSilicon body diodes. With Silicon body diodes, the main electricalproperties are controlled via the doping and device dimensions, and boththe minority and majority carriers affect device operation. Inparticular, during switching operations conventional silicon devicesexperience a so-called “reverse recovery time” which represents a timedelay needed to remove the stored charges during the device conductionbefore the device can enter blocking mode operation. This reverserecovery time delay is particularly detrimental because it highlyincreases switching losses. For this particular reason, Schottky diodesand in general majority carrier devices, are preferred in applicationswhere higher losses due to diode reverse recovery time cannot betolerated.

GaN/AlGaN technology represents a large step forward in powerelectronics due to higher performance in terms of current drivecapability, breakdown strength, and switching frequency to name a few,when compared to conventional silicon technology. One key feature ofconventional present-day GaN/AlGaN technology, which is a disadvantagefor forming integrated diodes, is the difficulty in accuratelycontrolling and activating doping in the device. Indeed, the mainelectrical properties of a typical GaN/AlGaN device are controlled viapolarization charges which allow the device performance to be tailoredwithout the use of doping. The difficulty in controlling doping in III-Vmaterials (especially p-type doping) represents a major drawback indesigning high-blocking mode and low forward bias diodes.

With a typical GaN/AlGaN HEMT there is no real body diode, as isconventionally present in a typical silicon device. However, when theHEMT device is in an off-state condition, i.e. in the absence of anelectron channel below the gate electrode, a pseudo-body diode can beobserved which connects the source terminal to the drain terminal. Anelectron in the channel of the pseudo-body diode must overcome an energybarrier having a certain height in order to traverse from the source todrain electrode. Different from conventional silicon technology, in GaNtechnology this barrier height is not fixed via the doping profile butby the material properties (energy gap) and also by the voltage appliedto the gate electrode. The stronger the device is biased in pinch-off,the higher the forward bias of the pseudo-body diode.

When a negative voltage is applied to the drain electrode, with thedevice being in off-state conditions, the conduction band on the drainside is pulled up and therefore the effective barrier height thatcarriers must overcome to reach the source electrode is lowered. When acertain threshold voltage is reached, the pseudo-body diode opens andallows current flow between the source and drain electrodes. However,typical forward bias voltages for such a pseudo-body diode in GaNtechnology is in the order of 3V and increases (becomes more negative)when the device is biased more strongly in off-state conditions. Thisparticular characteristic of the pseudo-body diode negatively impactsthe switching behavior of the power transistor in all applications wherea low forward bias body diode is needed. In some conventionalapproaches, a lateral Schottky diode with a low forward bias isintegrated with the HEMT. This approach however results in an areapenalty due to integration of a series lateral device. Also, thepre-existing GaN baseline process must be modified to include a lowforward bias Schottky diode which increases cost. Furthermore, theSchottky diode can become unstable due to surface effects.

SUMMARY

According to the embodiments described herein, a high electron mobilitytransistor (HEMT) is provided with an integrated diode having a lowforward bias, stable threshold voltage and high current drivecapability.

According to an embodiment of an HEMT, the HEMT includes a source, gateand drain, a first III-V semiconductor region having a two-dimensionalelectron gas (2DEG) which provides a first conductive channelcontrollable by the gate between the source and drain, and a secondIII-V semiconductor region below the first III-V semiconductor regionand having a second conductive channel connected to the source or drainand not controllable by the gate. The first and second III-Vsemiconductor regions are spaced apart from one another by a region ofthe high electron mobility transistor having a different band gap thanthe first and second III-V semiconductor regions.

According to another embodiment of an HEMT, the HEMT includes a diode, a2DEG providing a first conductive channel disposed in a III-Vsemiconductor region, the first 2DEG and the drain forming a cathode ofthe diode, and a second conductive channel below the first conductivechannel, the second conductive channel and the source forming an anodeof the diode. The diode has a low enough energy barrier in an off-stateof the high electron mobility transistor so that the diode has a forwardbias voltage of less than 1V in the off-state.

According to yet another embodiment of an HEMT, the HEMT includes asource, gate and drain, a first GaN region having a 2DEG which providesa first conductive channel controllable by the gate between the sourceand drain, a second GaN region below the first GaN region and having asecond conductive channel, and a plurality of AlGaN layers interposedbetween the first and second GaN layers so that the first and secondconductive channels are spaced apart from one another by the pluralityof AlGaN layers.

According to an embodiment of a method of manufacturing an HEMT having asource, drain and gate, the method includes: providing a first III-Vsemiconductor region having a 2DEG which provides a first conductivechannel controllable by the gate between the source and the drain;providing a second III-V semiconductor region below the first III-Vsemiconductor region and having a second conductive channel connected tothe source or drain and not controllable by the gate; and providing aregion of the high electron mobility transistor interposed between thefirst and second III-V semiconductor regions with a different band gapthan the first and second III-V semiconductor regions.

Those skilled in the art will recognize additional features andadvantages upon reading the following detailed description, and uponviewing the accompanying drawings.

BRIEF DESCRIPTION OF THE FIGURES

The elements of the drawings are not necessarily to scale relative toeach other. Like reference numerals designate corresponding similarparts. The features of the various illustrated embodiments can becombined unless they exclude each other. Embodiments are depicted in thedrawings and are detailed in the description which follows.

FIG. 1 illustrates a cross-sectional perspective view of an embodimentof an HEMT with an integrated low forward bias diode.

FIG. 2 illustrates a cross-sectional perspective view of an embodimentof a compensation structure included in the HEMT of FIG. 1.

FIG. 3 illustrates a cross-sectional perspective view of anotherembodiment of the compensation structure included in the HEMT of FIG. 1.

FIG. 4 illustrates a graphical representation of the I-V characteristicsof the integrated diode of FIG. 1 and a pseudo diode included in aconventional HEMT.

FIG. 5 illustrates a cross-sectional perspective view of anotherembodiment of an HEMT with an integrated low forward bias diode.

DETAILED DESCRIPTION

FIG. 1 illustrates an embodiment of a high electron mobility transistor(HEMT) 100 with an integrated diode 102 having a low forward bias,stable threshold voltage and high current drive capability. The diode102 is schematically illustrated in FIG. 1. The HEMT 100 is well-suitedfor lower voltage applications e.g. in the range of about 30 to 100V.The HEMT 100 includes a semiconductor substrate 104 such as a Si, SiC orsapphire wafer, and depending on the type of substrate employed, mayinclude an optional isolation layer 106 such as an AlN layer formed onthe substrate 104. A lower III-V semiconductor buffer region 108 such asa GaN layer is formed on the optional isolation layer 106 or directly onthe substrate 104. A compensation structure 110 is formed on the lowerIII-V semiconductor buffer region 108 and an upper III-V semiconductorbuffer region 116 such as a GaN layer is formed on the compensationstructure 110 so that the compensation structure 110 is interposedbetween the upper and lower III-V semiconductor buffer regions 116, 108.

The compensation structure 110 has a different band gap (e.g. a higherband gap) than the upper and lower III-V semiconductor buffer regions116, 108. According to an embodiment, the compensation structure 110includes at least one layer 112 containing Al formed on the lower III-Vsemiconductor buffer region 108. The Al content of the lowermost layer112 of the compensation structure 110 can be selected so that atwo-dimensional electron gas (2DEG) 114 arises in the lower III-Vsemiconductor buffer region 108. The 2DEG 114 automatically results in athin conductive channel (inversion layer) in the lower III-Vsemiconductor buffer region 108. Alternatively, an upper layer of thelower III-V semiconductor buffer region 108 or the lowermost layer 112of the compensation structure 110 may be doped n+ e.g. with a dopingconcentration of at least 1×10¹⁸ cm-3 in order to form the channel inthe lower III-V semiconductor buffer region 108. In either case (viastrain and polarization effects or doping), the lower III-Vsemiconductor buffer region 108 has a conductive channel.

The compensation structure 110 is interposed between the upper and lowerIII-V semiconductor buffer regions 116, 108 as shown in FIG. 1. Abarrier layer 118 e.g. which contains Al such as an AlGaN layer isformed on the upper III-V semiconductor buffer region 116. The Alcontent of the barrier layer 118 is high enough so that a 2DEG 120arises in the upper III-V semiconductor buffer region 116 via strain andpolarization effects. The 2DEG 120 automatically results in a thinconductive channel in the upper III-V semiconductor buffer region 116.This way, the HEMT 100 has an upper 2DEG 120 and corresponding upperchannel and a lower channel (and possibly a corresponding lower 2DEG 114depending on whether strain and polarization effects or doping isemployed to form the lower channel as described above) which are spacedapart from one another by the compensation structure 110. A cap layer122 such as a GaN layer is formed on the barrier layer 118, and a gate(G) is formed above the cap layer 122 for controlling a channel(inversion layer) of the HEMT 100.

The upper channel which results from the upper 2DEG 120 connects thesource (S) and drain (D) of the HEMT 100 and forms the main channel ofthe device. The gate controls whether the upper channel is continuous(conducting channel) so that the HEMT 100 can be operated in anon-state, or pinched off (non-conducting channel) so that the HEMT 100can be operated in an off-state via the gate voltage. A positivethreshold voltage HEMT is commonly referred to as a ‘normally-off’ HEMT.However, the HEMT 100 may instead be a ‘normally-on’ device in that thetransistor has a negative threshold voltage. The integrated diode 102 isnot dependent on the particular transistor configuration, i.e.normally-on or normally-off. Instead, the diode 102 can be integratedinto either type of HEMT device without additional changes. With thisunderstanding, the HEMT 100 is placed in the on-state by applying avoltage to the gate which is above the threshold voltage. In theon-state, current flows from the source (S) to drain (D) via the upperchannel. The HEMT 100 is placed in the off-state by applying a voltageto the gate which is below the threshold voltage. In the off-state theupper channel is pinched off so that no (or minimal) current flows fromthe source to drain. Prior to enter a blocking mode of the off-state, itmay be desirable for the HEMT 100 to enter a reverse off-state mode byapplying a negative voltage to the drain in order to remove excesscharge carriers. In the reverse off-state mode, the HEMT 100 is still inthe off-state with the upper channel pinched off. Also, the integrateddiode 102 is forward biased and permits current to flow from the source,through the lower channel and compensation structure 110, then throughthe upper III-V semiconductor buffer region 116 and is finally collectedat the drain.

During normal device operation, the diode 102 does not influence thebehavior of the HEMT 100 and, in both on-state (e.g. positive gatevoltage, positive drain voltage for a normally-on device) and off-state(e.g. negative gate voltage, positive drain voltage for a normally-ondevice) conditions, the current flows laterally, parallel to thebarrier/upper buffer interface 124. When a negative voltage is appliedto the drain in the off-state, the HEMT 100 enters the reverse off-statemode and the diode 102 is forward biased at a low voltage. That is, thediode 102 is forward biased when the drain voltage is lower than thesource voltage by the forward voltage drop.

The source and drain of the HEMT 100 extend through the cap layer 122and barrier layer 118 into the upper III-V semiconductor buffer region116 and are connected by the upper channel in the on-state. Either thesource or drain extends further to the lower channel (e.g. to the lower2DEG 114 in FIG. 1) in order to form an electrical connection to theintegrated diode 120. FIG. 1 shows the source extending to the lower2DEG 114. In an alternative embodiment the drain and not source extendsdeeper to the lower 2DEG 114 as indicated in parenthesis. As describedabove, only the lower channel and not the lower 2DEG 114 may be presentin the lower part of the HEMT 100 if doping is employed to form thelower channel instead of strain and polarization effects. In eithercase, the lower channel forms in about the same region as the lower 2DEG114 and therefore a separate reference number for the lower channel isnot show in FIG. 1 just as a separate reference number is not shown forthe upper channel which forms along the upper 2DEG 120.

In each case, the integrated diode 102 has a cathode formed by the upper2DEG 120 and drain and an anode formed by the lower channel and source.The upper 2DEG 120 and channel of the HEMT 100 are not affected by thepresence of the diode 102. In addition, the diode 102 has a low enoughenergy barrier in the off-state of the HEMT 100 so that the diode 102forward biases at 1V or less (with reference to a negative drainvoltage) to enter the reverse off-state mode in which the channel of theHEMT 100 remains pinched off (non- conducting) and the diode 102 andlower channel (and also the lower 2DEG 114 in some embodiments) conductcurrent in the reverse direction (from drain to source). In oneembodiment, the diode 102 has a low enough energy barrier in theoff-state so that the diode 102 has a forward bias voltage of less than0.8V, or even less than 0.6V. In some embodiments, the forward biasvoltage of the diode 102 is between 0.1 and 0.6 V. Such a low forwardbias diode 102 is realized by incorporating the compensation structure110 into the HEMT 100 between the upper 2DEG 120 and the lower channel.(and also the lower 2DEG 114 in some embodiments).

In one embodiment, the compensation structure 110 contains a sufficientamount of Al to form the lower 2DEG 114 (and lower channel) as describedabove. The polarization charges and different energy gaps made availableby the Al-containing compensation structure 110 yield a distinctiveconduction band profile so that the compensation structure 110 has arelatively flat energy barrier height region in which the electric fieldis close to zero. The upper and lower channels are separated by thisrelatively flat energy barrier height region of the compensationstructure 110. The junction between the upper channel and the upperIII-V semiconductor buffer region 116 has a much higher energy barrierheight in the HEMT off-state as compared to the diode 102. The barrierheight of the diode 102 results in a lower forward bias. In oneembodiment, the barrier height is <1 eV e.g. 0.6 to 0.8 eV in order toimplement a diode 102 with a low forward bias of <1 V.

A low barrier height e.g. of <1 eV in this lower region of the HEMT 100can be realized by selecting the Al content of the compensationstructure 110 so that the electric field and barrier height of the lowerconducting region are shaped as desired. Once carriers (electrons) crossthis barrier, they are free to flow from the drain to the source via thelower channel (and the lower 2DEG 114 if provided). As shown in FIG. 1,the compensation structure 110 can include a plurality of layers 112,one or more of which contain Al. Providing a compensation structure 110that contains Al not only results in the formation of the lower 2DEG 114via polarization charges, but also fixes the barrier height of the diode102 and distance between the two carrier reservoirs (i.e. the two2DEGs). However, the diode 102 can have an undesirable ambipolarbehavior (i.e. the diode can conduct current in both directions) ifthere is not sufficient separation between the upper and lower 2DEGs120, 114. Inserting the compensation structure 110 in the HEMT 100 fixesthe barrier height of the diode 102 to a value suitable for having a lowforward bias. Moreover, the barrier height of the diode 102 does notincrease with increasing the distance between the upper and lowerchannels, as would be the case for a non-compensating electric field. Onthe contrary, the presence of the compensation structure 110 provides arelatively flat central region where the conduction band profile isgenerally flat as described above.

The compensation structure 110 can be made thick enough to avoid thediode ambipolar behavior. The diode 102 is designed to have a lowbarrier height (and thus low forward bias) as described above, and asufficient separation is provided between the upper and lower channelsvia the compensation structure 110 so that the diode 102 can conductcurrent in one direction but not in the reverse direction. By providingcompensation layers of appropriate thickness and Al content in thecompensation structure 110, a central region with zero electric field isprovided in the HEMT 100 as described above. Such a structure providessufficient separation between the upper and lower channels withoutadversely increasing the forward bias voltage of the diode 102.

In one embodiment, the upper and lower channels are spaced at least 300nm apart and the diode 102 has a forward bias voltage of 1V or less. Theupper and channels can be spaced at least 500 nm apart, or spacedbetween 500 nm apart and 1 μm apart or further and the diode 102 stillhas a forward bias voltage of about 1V or less by appropriatelyselecting the layer thickness and band gap of the compensation structure110. In general, the compensation structure 110 decouples the barrierheight of the diode 102 from the distance between the upper and lowerchannels.

FIG. 2 illustrates an exploded view of an embodiment of the compensationstructure 110, in a dashed region 126 of FIG. 1. According to thisembodiment, the compensation structure 110 includes four AlGaN layers200, 210, 220, 230 interposed between upper and lower GaN buffer regions116, 108. The upper and lower GaN buffer regions 116, 108 each have a2DEG as explained previously herein. Only the lower 2DEG 114 is visiblein FIG. 2.

The layers 200, 210, 220, 230 of the compensation structure 110 can havethe same or different Al content. In one embodiment, the uppermost layer200 of the compensation structure 110 has the most Al content e.g. about4%, the layer 210 immediately below the uppermost layer 200 has e.g.about 1% Al and the next lowest layer 220 has e.g. about 2% Al content.The lowest layer 230 of the compensation structure 110 can include asufficient amount of Al to form the lower 2DEG 114 in the lower GaNbuffer region 108 via polarization effects.

FIG. 3 shows an alternative embodiment of the compensation structure110. The structure 110 shown in FIG. 3 is similar to the one shown inFIG. 2, however the lowermost layer 300 of the compensation structure110 contains no appreciable Al and instead is heavily n+ doped e.g. witha concentration of at least 1×10¹⁸ cm-3. As such, the Al containinglayers 200, 210, 220 of the compensation structure 110 are interposedbetween the upper GaN buffer region 116 and the lowermost doped(non-aluminium containing) layer 300 of the compensation structure 110.The doping of the lowermost layer 300 is sufficient to form theconductive channel 302 in the lowermost layer 300 of the compensationstructure 110 without having to employ a 2DEG in this lower part of theHEMT 100.

In each case, upper and lower channels are provided and the thicknessand band gap of the compensation structure 110 ensures the integrated102 has a low forward bias, stable threshold voltage and high currentdrive capability in the HEMT off-state. Also in each case, the layers ofthe compensation structure 110 can have the same or different thickness.In one embodiment, the layers of the compensation structure 110 haveapproximately the same thickness e.g. about 10 to 20 nm.

FIG. 4 illustrates a comparison of the electrical characteristics of aGaN HEMT in off-state conditions, when a negative voltage is applied tothe drain electrode. The graph plots voltage (x-axis) versus current(y-axis). Both a conventional GaN HEMT (represented by the curve labeled“with diode”) and the HEMT 100 described herein with an integrated diode102 (represented by the curve labeled “without diode”) are compared. Inboth cases the transistor is biased in off-state conditions, i.e. themain channel is depleted below the gate electrode in order to avoiddirect current flow from the source to drain via the channel. A negativevoltage is then applied to the drain and when this voltage issufficiently negative, the diode 102 opens and current can flow. Ofcourse the opposite gate and drain voltage polarities are used fornormally-on devices. In a conventional GaN HEMT, the pseudo diodedescribed in the background section opens at around 3V while theintegrated diode 102 described herein has a significantly lower forwardbias of 1 V or less, e.g. in the order of 0.1 to 0.6 V (with referenceto a negative drain voltage).

FIG. 5 illustrates another embodiment of the HEMT 100. The embodimentshown in FIG. 5 is similar to the one shown in FIG. 1. Differentlyhowever the source (or drain) includes an upper region 400 which extendsfrom a top side 402 of the device into the upper III- V semiconductorbuffer region 116 and a lower region 404 which extends from an opposingbottom side 406 of the device into the lower III-V semiconductor bufferregion 108. The upper source (or drain) region 400 is in electricalcontact with the upper 2DEG 120 and the lower second source (or drain)region 404 is in electrical contact with the lower channel (and lower2DEG 114 if present). The upper and lower regions 400, 404 of the source(or drain) are spaced apart from one another by the compensationstructure 110. This way, the source (or drain) can be contacted fromboth the top side 402 and bottom side 406. In the on-state, currentflows from the upper source region 400 through the channel to the drainvia the upper channel and 2DEG 120. In the reverse off-state mode, theupper channel is pinched off and current flows from the lower sourceregion 404 to the drain via the lower channel (and lower 2DEG 114 ispresent) and the forward biased diode 102.

The integrated diode 102 described herein utilizes two differentchannels separated by a barrier height that can be tailored depending onthe desired diode forward bias point. The integrated diode 102 describedherein can make use of polarization charges to realize upper and lower2DEG regions 120, 114 (or at least the upper 2DEG 120 where the lower2DEG 114 alternatively can be realized by doping as described hereine.g. with reference to FIG. 3). Providing a stack of AlGaN layers as thecompensation structure 110 fixes the barrier height of the diode 102 toa desired value. With a sufficient thickness and band gap, thecompensation structure 110 in general suppresses the ambipolar diodebehavior while decoupling the diode barrier height from the distancebetween the upper and lower channels.

Spatially relative terms such as “under”, “below”, “lower”, “over”,“upper” and the like, are used for ease of description to explain thepositioning of one element relative to a second element. These terms areintended to encompass different orientations of the device in additionto different orientations than those depicted in the figures. Further,terms such as “first”, “second”, and the like, are also used to describevarious elements, regions, sections, etc. and are also not intended tobe limiting. Like terms refer to like elements throughout thedescription.

As used herein, the terms “having”, “containing”, “including”,“comprising” and the like are open ended terms that indicate thepresence of stated elements or features, but do not preclude additionalelements or features. The articles “a”, “an” and “the” are intended toinclude the plural as well as the singular, unless the context clearlyindicates otherwise.

It is to be understood that the features of the various embodimentsdescribed herein may be combined with each other, unless specificallynoted otherwise.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat a variety of alternate and/or equivalent implementations may besubstituted for the specific embodiments shown and described withoutdeparting from the scope of the present invention. This application isintended to cover any adaptations or variations of the specificembodiments discussed herein. Therefore, it is intended that thisinvention be limited only by the claims and the equivalents thereof.

What is claimed is:
 1. A high electron mobility transistor, comprising:a source, a gate and a drain; a first III-V semiconductor region; asecond III-V semiconductor region below the first III-V semiconductorregion; and a compensation structure interposed between the first andsecond III-V semiconductor regions so that the first and second III-Vsemiconductor regions are spaced apart from one another by thecompensation structure, the compensation structure having a differentband gap than the first and second III-V semiconductor regions.
 2. Thehigh electron mobility transistor of claim 1, wherein the first III-Vsemiconductor region has a conductive channel that connects the sourceand the drain when the high electron mobility transistor is in anon-state, and wherein the second III-V semiconductor region has aconductive channel that connects the source and the drain in reversebias when the high electron mobility transistor is in an off-state. 3.The high electron mobility transistor of claim 1, wherein the source orthe drain extends through the first III-V semiconductor region and intothe second III-V semiconductor region.
 4. The high electron mobilitytransistor of claim 1, wherein the source or the drain comprises a firstregion that extends into the first III-V semiconductor region and asecond region that extends into the second III-V semiconductor region,and wherein the first and second regions of the source or drain arespaced apart from one another by the compensation structure.
 5. The highelectron mobility transistor of claim 1, wherein the compensationstructure comprises a plurality of layers containing Al.
 6. The highelectron mobility transistor of claim 5, wherein the plurality of layershave different Al content.
 7. The high electron mobility transistor ofclaim 5, wherein one of the plurality of layers is adjacent the firstIII-V semiconductor region and has a higher Al content than the otherlayers.
 8. The high electron mobility transistor of claim 5, wherein oneor more of the plurality of layers contains between 4% and 1% Al.
 9. Thehigh electron mobility transistor of claim 5, further comprising: anadditional layer disposed below the plurality of layers so that theplurality of layers is interposed between the first III-V semiconductorregion and the additional layer, wherein the additional layer forms thesecond III-V semiconductor region and is doped high enough to generate aconductive channel.
 10. The high electron mobility transistor of claim5, wherein one of the plurality of layers is adjacent the second III-Vsemiconductor region and contains enough Al to form a two- dimensionalelectron gas in the second III-V semiconductor region.
 11. The highelectron mobility transistor of claim 1, further comprising: anintegrated diode operable to permit current to flow from the source,through the second III-V semiconductor region and the compensationstructure, and then through the first III-V semiconductor region to thedrain when the integrated diode is forward biased.
 12. The high electronmobility transistor of claim 11, wherein the integrated diode is forwardbiased only when the high electron mobility transistor is in a reverseoff-state mode in which a negative voltage is applied to the drain. 13.The high electron mobility transistor of claim 11, wherein theintegrated diode has a forward bias voltage of less than 1V in anoff-state of the high electron mobility transistor.
 14. The highelectron mobility transistor of claim 13, wherein the integrated diodehas an energy barrier less than 1 eV in the off-state.
 15. A highelectron mobility transistor, comprising: a source, a gate and a drain;a first GaN region; a second GaN region below the first GaN region; anda plurality of AlGaN layers interposed between the first and second GaNlayers so that a first GaN/AlGaN junction is formed between the firstGaN region and the AlGaN layer adjacent the first GaN region and asecond GaN/AlGaN junction is formed between the second GaN region andthe AlGaN layer adjacent the second GaN region.
 16. The high electronmobility transistor of claim 15, wherein the plurality of AlGaN layershave different Al content.
 17. The high electron mobility transistor ofclaim 15, wherein the AlGaN layers adjacent the first GaN region has ahigher Al content than the other AlGaN layers.
 18. The high electronmobility transistor of claim 15, wherein one or more of the plurality ofAlGaN layers contains between 4% and 1% Al.
 19. The high electronmobility transistor of claim 15, further comprising: an additional layerdisposed below the plurality of AlGaN layers so that the plurality ofAlGaN layers is interposed between the first GaN region and theadditional layer, wherein the additional layer is the second GaN regionand is doped high enough to form a conductive channel.
 20. A method ofmanufacturing a high electron mobility transistor having a source, adrain and a gate, the method comprising: forming a first III-Vsemiconductor region; forming a second III-V semiconductor region belowthe first III-V semiconductor region; and forming a compensationstructure interposed between the first and second III-V semiconductorregions so that the first and second III-V semiconductor regions arespaced apart from one another, the compensation structure having adifferent band gap than the first and second III-V semiconductorregions.